{"Category":"Integrated Circuits (ICs)","Current - Timekeeping (Max)":"2\u00b5A @ 3.3V","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Memory Size":"56B","Package \/ Case":"8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)","Type":"Clock\/Calendar","Product Photos":"8-TSSOP 8-MSOP","PCN Assembly\/Origin":"Wafer Fab Transfer 08\/Apr\/2014 Wafer Fab Transfer Revision 02\/Jul\/2014","PCN Design\/Specification":"Copper Bond Wire 16\/Oct\/2014","Date Format":"YY-MM-DD-dd","Datasheets":"IDT1338 1337-39 RTC Product Brief...

{"Category":"Integrated Circuits (ICs)","Current - Timekeeping (Max)":"2\u00b5A @ 3.3V","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Memory Size":"56B","Package \/ Case":"8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)","Type":"Clock\/Calendar","Product Photos":"8-TSSOP 8-MSOP","PCN Assembly\/Origin":"Wafer Fab Transfer 08\/Apr\/2014 Wafer Fab Transfer Revision 02\/Jul\/2014","PCN Design\/Specification":"Copper Bond Wire 16\/Oct\/2014","Date Format":"YY-MM-DD-dd","Datasheets":"IDT1338 1337-39 RTC Product Brief...