{"Category":"Integrated Circuits (ICs)","Current - Timekeeping (Max)":"200\u00b5A @ 3.63V ~ 5.5V","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Memory Size":"-","Package \/ Case":"8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)","Type":"Clock\/Calendar","Product Photos":"8-TSSOP 8-MSOP","PCN Assembly\/Origin":"Wafer Fab Transfer 08\/Apr\/2014 Wafer Fab Transfer Revision 02\/Jul\/2014","PCN Design\/Specification":"Gpld\/Copper Bond Wire 21\/Dec\/2012","Date Format":"YY-MM-DD-dd","Datasheets":"IDT1339 IDT133(7-9)...

{"Category":"Integrated Circuits (ICs)","Current - Timekeeping (Max)":"200\u00b5A @ 3.63V ~ 5.5V","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Memory Size":"-","Package \/ Case":"8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)","Type":"Clock\/Calendar","Product Photos":"8-TSSOP 8-MSOP","PCN Assembly\/Origin":"Wafer Fab Transfer 08\/Apr\/2014 Wafer Fab Transfer Revision 02\/Jul\/2014","PCN Design\/Specification":"Gpld\/Copper Bond Wire 21\/Dec\/2012","Date Format":"YY-MM-DD-dd","Datasheets":"IDT1339 IDT133(7-9)...