EPC2010 TRANS GAN 200V 12A BUMPED DIE
From EPC
Category | Discrete Semiconductor Products |
Current - Continuous Drain (Id) @ 25°C | 12A (Ta) |
Datasheets | EPC2010 |
Drain to Source Voltage (Vdss) | 200V |
FET Feature | Logic Level Gate |
FET Type | GaNFET N-Channel, Gallium Nitride |
Family | FETs - Single |
Featured Product | eGaN™ FETs |
For Use With | 917-1012-ND - BOARD DEV FOR EPC2010 200V GAN |
Gate Charge (Qg) @ Vgs | 5nC @ 5V |
Input Capacitance (Ciss) @ Vds | 480pF @ 100V |
Mfg Application Notes | Second Generation eGaN® FETs Assembling eGaN® FETs Using eGaN® FETs |
Mounting Type | Surface Mount |
Online Catalog | N-Channel Logic Level Gate FETs |
Other Names | 917-1016-2 |
PCN Assembly/Origin | EPC2yyy Family Process Change 14/Dec/2013 |
PCN Design/Specification | EPC20xx Material 10/Apr/2013 |
Package / Case | Die |
Packaging | Tape & Reel (TR) |
Power - Max | - |
Product Photos | EPC2010 |
Product Training Modules | Paralleling eGaN® FETs |
Rds On (Max) @ Id, Vgs | 25 mOhm @ 6A, 5V |
Series | eGaN® |
Standard Package | 500 |
Supplier Device Package | Die |
Vgs(th) (Max) @ Id | 2.5V @ 3mA |
Video File | EPC eGaN FETs -- Another Geek Moment | DigiKey |