{"Status":"ACTIVE","Terminal Finish":"TIN LEAD","Package Body Material":"PLASTIC\/EPOXY","Mfr Package Description":"PLASTIC, BGA-329","Communication Protocol":"SYNC, HDLC","Terminal Form":"BALL","Package Style":"GRID ARRAY","Data Transfer Rate-Max":"8.192M","External Data Bus Width":"16","Number of I\/O Lines":"32","Boundary Scan":"Yes","Supply Voltage-Nom (Vsup)":"3.3 V","Address Bus Width":"12","Number of Functions":"1","Terminal Position":"BOTTOM","Terminal Pitch":"1.27 mm","Package Shape":"SQUARE","Micr...

{"Terminal Finish":"TIN LEAD","Terminal Pitch":"1.27 mm","Clock Freq-Max (fclk)":"45 MHz","Terminal Form":"BALL","Data Encoding\/Decoding Method":"NRZ","Operating Temperature-Max":"85 Cel","Supply Voltage-Nom (Vsup)":"2.5 V","Temperature Grade":"INDUSTRIAL","Microprocess IC Type":"SERIAL COMM CONTROLLER","Package Shape":"SQUARE","Status":"ACTIVE","Data Transfer Rate-Max":"8.192M","Operating Temperature-Min":"-40 Cel","Package Body Material":"PLASTIC\/EPOXY","Number of Functions":"1","External Data Bus Width...